High-frequency antenna module and array antenna device

ABSTRACT

A high-frequency antenna module includes: a substrate; an input port to which an RF signal is inputted; a distribution circuit configured to distribute the RF signal inputted to the input port; a plurality of amplification units which each have a plurality of cascade-connected amplifiers configured to amplify the RF signal distributed by the distribution circuit, and which are arranged on a side of the substrate provided with the distribution circuit to be rotationally symmetric about the distribution circuit; a plurality of antennas provided on a side of the substrate opposite to the side provided with the amplification units, and each configured to emit the RF signal amplified by the amplification unit corresponding thereto to a space; and a plurality of RF signal supplying portions each configured to supply the RF signal amplified by the amplification unit to the antenna corresponding thereto.

TECHNICAL FIELD

The present disclosure relates to a high-frequency antenna module whichemits a high-frequency signal to a space, and an array antenna deviceusing the same.

BACKGROUND ART

A high-frequency module for amplifying a microwave signal is used for acommunication device, a radar device, a power transmission device, andthe like. For example, in an active phased array antenna, a plurality ofhigh-frequency modules are connected in parallel for power synthesis andbeam control. There have been proposed several methods for achieving athinner and smaller-sized array antenna device by sharing an inputconnector, distributing a signal to a plurality of high-frequencymodules, and thereby reducing the number of coaxial connectors.

There has been proposed a method in which an insulating substrateequipped with high-frequency electronic components and an antennasubstrate equipped with a plurality of antennas are arranged with ametal casing being sandwiched therebetween, these substrates areconnected by one coaxial cable, and the antenna substrate performsdistribution (see Patent Document 1).

There has been proposed a method in which a plurality of antennas,amplification circuits for the respective antennas, and a distributioncircuit configured to distribute an RF (Radio Frequency) signal to therespective amplification circuits are integrated and implemented in asingle-layer substrate or a multilayer substrate (see Patent Document2).

CITATION LIST Patent Document

-   Patent Document 1: Japanese Patent Laying-Open No. 2012-109670-   Patent Document 2: Japanese Patent Laying-Open No. 2014-017598

SUMMARY OF DISCLOSURE Technical Problem

With the method of Patent Document 1, it is difficult to achieve afurther thinner high-frequency module, because the high-frequencyelectronic components are separated from the antenna substrate. In ahigh-frequency module having a plurality of antennas, lengths of wiresfrom a distribution circuit to the antennas should be identical.However, Patent Document 2 has no description about the lengths ofwires.

The present disclosure has been made to solve the aforementionedproblems, and an object of the present disclosure is to obtain ahigh-frequency antenna module which can easily match phases of aplurality of antennas when an input connector is shared and adistribution circuit is used to distribute a signal to the plurality ofantennas, and which achieves reduction in thickness.

Solution to Problem

A high-frequency antenna module according to the present disclosureincludes: a substrate; an input port to which an RF signal is inputted;a distribution circuit configured to distribute the RF signal inputtedto the input port; a plurality of amplification units which each have aplurality of cascade-connected amplifiers configured to amplify the RFsignal distributed by the distribution circuit, and which are arrangedon a side of the substrate provided with the distribution circuit to berotationally symmetric about the distribution circuit; a plurality ofantennas provided on a side of the substrate opposite to the sideprovided with the amplification units, and each configured to emit theRF signal amplified by the amplification unit corresponding thereto to aspace; and a plurality of RF signal supplying portions each configuredto supply the RF signal amplified by the amplification unit to theantenna corresponding thereto.

Advantageous Effects of Disclosure

According to the present disclosure, a high-frequency antenna modulewhich achieves an equal length of wires to a plurality of antennas whenan input connector is shared and a distribution circuit is used todistribute a signal to the plurality of antennas, and which can achievereduction in thickness is obtained.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view of a high-frequency antenna moduleaccording to a first embodiment of the present disclosure, seen from anantenna side.

FIG. 2 is a perspective view of the high-frequency antenna module seenfrom a metal block side, in the high-frequency antenna module accordingto the first embodiment.

FIG. 3 is an exploded view showing a configuration of the high-frequencyantenna module according to the first embodiment.

FIG. 4 is a circuit diagram illustrating an electric configuration ofthe high-frequency antenna module according to the first embodiment.

FIG. 5 is a plan view illustrating arrangement of electronic componentson substrates of the high-frequency antenna modules according to thefirst embodiment.

FIG. 6 is an exploded view of an array antenna device according to thefirst embodiment.

FIG. 7 is a cross sectional view of the array antenna device accordingto the first embodiment, taken along a line A-A shown in FIG. 6.

FIG. 8 is a plan view illustrating arrangement of electronic componentson substrates of high-frequency antenna modules according to a secondembodiment of the present disclosure.

FIG. 9 is a plan view illustrating arrangement of electronic componentson a substrate of a high-frequency antenna module according to a thirdembodiment of the present disclosure.

FIG. 10 is a plan view showing one example where the high-frequencyantenna modules according to the third embodiment are arranged in anarray.

FIG. 11 is a plan view showing another example where the high-frequencyantenna modules according to the third embodiment are arranged in anarray.

FIG. 12 is a plan view illustrating arrangement of electronic componentson a substrate of a high-frequency antenna module according to a fourthembodiment of the present disclosure.

FIG. 13 is a circuit diagram illustrating an electric configuration of ahigh-frequency antenna module according to a fifth embodiment of thepresent disclosure.

FIG. 14 is a plan view illustrating arrangement of electronic componentson substrates of the high-frequency antenna modules according to thefifth embodiment.

FIG. 15 is a plan view illustrating arrangement of electronic componentson substrates of high-frequency antenna modules according to a sixthembodiment of the present disclosure.

FIG. 16 is a plan view illustrating arrangement of electronic componentson substrates of high-frequency antenna modules according to a seventhembodiment of the present disclosure.

FIG. 17 is a plan view illustrating arrangement of electronic componentson substrates of high-frequency antenna modules according to an eighthembodiment of the present disclosure.

FIG. 18 is a plan view illustrating arrangement of electronic componentson substrates of high-frequency antenna modules according to a ninthembodiment of the present disclosure.

DESCRIPTION OF EMBODIMENTS First Embodiment

A structure of a high-frequency antenna module 100 according to a firstembodiment of the present disclosure is described with reference toFIGS. 1 to 3. FIG. 1 is a perspective view of a high-frequency antennamodule according to the first embodiment of the present disclosure, seenfrom an antenna side. FIG. 2 is a perspective view of the high-frequencyantenna module seen from a metal block side, in the high-frequencyantenna module according to the first embodiment. FIG. 3 is an explodedview showing a configuration of the high-frequency antenna moduleaccording to the first embodiment. A substrate may be a single-layersubstrate.

High-frequency antenna module 100 has an outer shape like a thick squareplate. A substrate 1 is a dielectric multilayer substrate havingtransmission lines in a surface layer and an internal layer and havingsquare-shaped main surfaces. A square whose corners are cut off by astraight line or a curved line is also called a square. Four elementantennas 2 are arranged on one main surface of substrate 1. A surface ofsubstrate 1 equipped with electronic components and the like and asurface opposite thereto are called main surfaces. Each element antenna2 emits an RF (Radio Frequency) signal of several GHz to a space. Eachelement antenna 2 is a patch antenna. An antenna of another type may beused as long as it has a sufficiently small height.

On the surface of substrate 1 opposite to the surface provided withelement antennas 2, four amplification units 3 are arranged tocorrespond to respective element antennas 2. A metal block 4 is providedto cover a distribution circuit 8, amplification units 3, and the like.Metal block 4 has the same size as that of substrate 1. Substrate 1 isfixed to metal block 4 with screws 5. Substrate 1 may be integrated withmetal block 4 by a method other than using screws.

On a substrate 1 side of metal block 4, recesses are provided to formspaces for housing the electronic components. The shape and size of eachrecess are appropriately determined such that oscillation of amplifiersdue to resonance of the space can be suppressed at a used frequency or adetermined frequency. Metal block 4 also has functions ofelectromagnetic shielding and heat dissipation. Metal block 4 is made ofa metal having a high thermal conductivity, such as aluminum. Metalblock 4 serves as a metal casing configured to house distributioncircuit 8 and amplification units 3 between substrate 1 and the metalcasing, and dissipate heat generated by heat generating portions ofamplification units 3. When heat is dissipated not through the metalblock, a block made of resin or the like may be used instead of themetal block. The block made of resin is provided with a conductor filmon its surface in order to have the function of electromagneticshielding.

At the center of a surface of metal block 4 on a side not connected tosubstrate 1 is provided a through hole 7 for exposing an input port 6 towhich an RF signal to be amplified is inputted. Input port 6 is providedon substrate 1 at a position corresponding to through hole 7.Distribution circuit 8 configured to distribute the RF signal to aplurality of (here, four) wires is connected to input port 6. Inschematic views such as FIG. 3, input port 6 and distribution circuit 8are integrally illustrated. The RF signal distributed by distributioncircuit 8 is inputted to each amplification unit 3. Four amplificationunits 3 having the same configuration are rotated by 90 degrees, and arearranged on the side of substrate 1 provided with distribution circuit 8to be rotationally symmetric about distribution circuit 8. Indistribution circuit 8, lengths of wires from input port 6 to inputpoints of amplification units 3 are identical. Distribution circuit 8 isarranged such that its center matches the center of substrate 1. To beprecise, amplification units 3 are arranged to be rotationally symmetricwith respect to the center of distribution circuit 8. Distributioncircuit 8 is also rotationally symmetric with respect to its center.

An electric configuration of high-frequency antenna module 100 isdescribed with reference to FIG. 4. FIG. 4 is a circuit diagramillustrating an electric configuration of the high-frequency antennamodule according to the first embodiment. Not only an RF signal line 31for transmitting the RF signal but also a control signal line 32 and adirect current (DC) power source line 33 are connected to input port 6.At input port 6, the RF signal is connected by a coaxial connector. Eachamplification unit 3, to which the RF signal distributed by distributioncircuit 8 is inputted, has a phase shifter 10, a first stage amplifier11, a second stage amplifier 12, a third stage amplifier 13, and anisolator 14 connected in series. Element antennas 2 arranged on the sideof substrate 1 opposite to the side provided with amplification units 3are connected to isolators 14, via through conductors 15 (shown in FIG.5) which penetrate substrate 1. Power may be fed to element antennas 2using a power feeding method which adopts electromagnetic coupling,instead of using through conductors 15. Through conductors 15 serve asRF signal supplying portions each configured to supply the RF signalamplified by amplification unit 3 to corresponding element antenna 2.

Phase shifter 10 controls the phase of the RF signal. In eachamplification unit 3, the phase of the RF signal can be individuallycontrolled to an arbitrary phase by a control signal inputted throughcontrol signal line 32. First stage amplifier 11, second stage amplifier12, and third stage amplifier 13 amplify the RF signal to a requiredlevel. The amplified RF signal is electrically separated by isolator 14and is supplied to element antenna 2. Element antenna 2 is an antennaconfigured to emit the RF signal to the space. The number of stages ofthe cascade-connected amplifiers may be two, or four or more. The numberof stages of the amplifiers is appropriately determined depending on theperformance of each amplifier and a required amplification degree.

Arrangement of the electronic components within each amplification unit3 is described with reference to FIG. 5. FIG. 5 is a plan viewillustrating arrangement of the electronic components on the substratesof the high-frequency antenna modules according to the first embodiment.FIG. 5 shows a total of four high-frequency antenna modules 100 (in tworows and two columns) arranged to show the positional relation amongthird stage amplifiers 13, which are amplifiers in the last stage andgenerate heat most in each amplification unit 3, in adjacenthigh-frequency antenna modules 100.

A description is given, taking upper right amplification unit 3 in upperright high-frequency antenna module 100 in FIG. 5 as an example. To makethe drawing easy to read, the reference numerals of the electroniccomponents are allotted to another amplification unit 3. A wire 21exiting distribution circuit 8 extends upward in the drawing, turns tothe right at a position which is about 25% of the length ofamplification unit 3 and then extends, and enters phase shifter 10. Awire 22 extending rightward from phase shifter 10 enters first stageamplifier 11. A wire 23 extending rightward from first stage amplifier11 turns upward near an end portion of substrate 1, and enters secondstage amplifier 12. A wire 24 extending upward from second stageamplifier 12 turns to the left near the upper right corner of substrate1, and enters third stage amplifier 13. A wire 25 extending leftwardfrom third stage amplifier 13 enters isolator 14. A wire 26 extendingdownward from isolator 14 turns to the right, and is connected tothrough conductor 15 provided substantially at the center ofamplification unit 3.

In four amplification units 3, paths from distribution circuit 8 toelement antennas 2 have the same configuration, and they are onlydifferent in orientation. Accordingly, lengths of the wires from inputport 6 to through conductors 15 are identical in respectiveamplification units 3. Since respective through conductors 15 of fouramplification units 3 are arranged at positions which are rotationallysymmetric with respect to distribution circuit 8, element antennas 2 arealso arranged at positions which are rotationally symmetric with respectto distribution circuit 8. As a result, lengths of the wires from inputport 6 to element antennas 2 are identical in respective amplificationunits 3.

In the exemplary arrangement shown in FIG. 5, third stage amplifiers 13in high-frequency antenna module 100 are arranged at corner portions ofsubstrate 1. A corner portion is a range which includes a corner and isdefined from the corner. Accordingly, respective third stage amplifiers13 within high-frequency antenna module 100 are separated from oneanother at an interval which is close to the width of substrate 1.Further, third stage amplifiers 13 in adjacent high-frequency antennamodules 100 are adjacent to one another. Third stage amplifiers 13,which are the amplifiers in the last stage, entirely or partly serve asheat generating portions which generate most of the heat generated inhigh-frequency antenna module 100. When the number of stages of theamplifiers is not three, the amplifiers in the last stage entirely orpartly serve as heat generating portions.

High-frequency antenna modules 100 are arranged in a two-dimensionalarray to constitute an array antenna device 200. FIG. 6 is an explodedview of an array antenna device according to the first embodiment. FIG.7 is a cross sectional view of the array antenna device according to thefirst embodiment, taken along a line A-A shown in FIG. 6. FIG. 6 showsthe portion of a total of four high-frequency antenna modules 100 (intwo rows and two columns) in a cut-out manner. Front left high-frequencyantenna module 100 is shown with substrate 1 being removed therefrom, toshow arrangement of the electronic components on the side of substrate 1not provided with element antennas 2.

Array antenna device 200 includes a plurality of high-frequency antennamodules 100 arranged in a two-dimensional array, a plate-like metal base50, and a base substrate 70 having connectors 60 connected to inputports 6 of high-frequency antenna modules 100. The number of connectors60 is the same as the number of high-frequency antenna modules 100.Metal base 50 serves as a module holding portion configured to hold theplurality of high-frequency antenna modules 100 and base substrate 70.

Metal base 50 has protruding portions 55 in the shape of a quadrangularprism which each come into contact with metal blocks 4 to include cornerportions of metal blocks 4 of four high-frequency antenna modules 100which share a corner. Protruding portions 55 transfer heat generated inhigh-frequency antenna modules 100 and transferred to metal blocks 4mainly through substrates 1, from metal blocks 4 to metal base 50.Thereby, protruding portions 55 cool high-frequency antenna modules 100.That is, protruding portions 55 serve as cooling portions configured tocool high-frequency antenna modules 100, i.e., metal blocks 4. A pipemay be provided inside each protruding portion 55, and cooling may beperformed using a coolant passing through the inside of the pipes. Finsmay be provided to metal base 50 to perform natural air cooling orforced air cooling. The fins may be provided in a concentrated manner atpositions corresponding to protruding portions 55. Protruding portions55 may be provided separately from metal base 50, and metal base 50 mayhold protruding portions 55. Also when protruding portions 55 areintegrated with metal base 50, it is considered that metal base 50 holdsprotruding portions 55.

Base substrate 70 is provided with openings at positions correspondingto protruding portions 55. Protruding portions 55 pass through theopenings in base substrate 70, and come into contact with metal blocks4. A surface of base substrate 70 is provided with wires 75 fordistributing the RF signal line, the DC power source line, and thecontrol signal line to connectors 60. Wires 75 are provided such thatlengths of wires from a power feeding source not shown to connectors 60are identical.

Operation of array antenna device 200 is described. The RF signal, DCpower, and the control signal are supplied from a power feeding circuitof array antenna device 200 to input ports 6 of high-frequency antennamodules 100 via wires 75 and connectors 60. The RF signal is distributedby each distribution circuit 8, and the distributed RF signal isamplified by each amplification unit 3 and emitted from each elementantenna 2 to the space. Since lengths of wires from the power feedingcircuit to all element antennas 2 are set to be identical, when thephase is controlled by the control signal such that the same phase isachieved in all element antennas 2, electric waves having the same phaseare emitted from all element antennas 2 to the space. When the phase iscontrolled by the control signal, the phase of an electric wave emittedby element antenna 2 becomes equal to a phase instructed to phaseshifter 10 in amplification unit 3 which supplies the RF signal to thatelement antenna 2.

Since four element antennas 2 share one input port 6, a mounting areacan be reduced. Since amplification units 3 and element antennas 2 arearranged to be rotationally symmetric about distribution circuit 8,special processing such as excess length processing is not required onsubstrate 1, and the lengths of the wires from input port 6 to elementantennas 2 can be set to be identical. The antennas are arranged on theback surface of the substrate, and there is no need to separate acircuit substrate and an antenna substrate. As a result, a smaller-sizedand thinner high-frequency antenna module can be achieved. Further,since special processing such as excess length processing is notrequired on the substrate, the degree of freedom in designing thesubstrate is improved.

Since protruding portions 55 serving as the cooling portions configuredto come into contact with metal blocks 4 to cool metal blocks 4 areprovided, high-frequency antenna modules 100 can be cooled efficiently.Since each protruding portion 55 is provided at a position correspondingto the heat generating portions of the plurality of adjacenthigh-frequency antenna modules 100, the number of protruding portions 55can be reduced. Since the number of protruding portions 55 is reducedand the size of one protruding portion is large, it is also possible touse a cooling portion having a higher cooling efficiency instead ofprotruding portion 55. By bringing each protruding portion 55 intocontact with metal blocks 4 at the position corresponding to the heatgenerating portions, protruding portions 55 can cool metal blocks 4efficiently. The position corresponding to the heat generating portionsis a position immediately below each heat generating portion, or aposition where each metal block comes into contact with each substrateat a location close to each heat generating portion, on a metal baseside.

The arrangement of the electronic components within each amplificationunit can be designed freely. The substrate may have main surfaces inanother shape such as a triangle, a hexagon, or the like, instead of asquare, as long as the shape is rotationally symmetric. The number ofdistribution by the distribution circuit is not limited to four.

The above description also applies to other embodiments.

Second Embodiment

A second embodiment illustrates a case where the arrangement of theelectronic components on the substrates of the high-frequency antennamodules is modified. FIG. 8 is a plan view illustrating arrangement ofelectronic components on substrates of high-frequency antenna modulesaccording to the second embodiment of the present disclosure. Ahigh-frequency antenna module 100A of the second embodiment is the sameas high-frequency antenna module 100 of the first embodiment inappearance and electric configuration thereof. In FIG. 8, componentswhich are identical or equal to those in FIGS. 1 to 7 are designated bythe same reference numerals, and the description thereof is notrepeated.

A description is given, taking an upper right amplification unit 3A inupper right high-frequency antenna module 100A in FIG. 8 as an example.To make the drawing easy to read, the reference numerals of theelectronic components are allotted to another amplification unit 3A. Awire 21A exiting distribution circuit 8 extends upward in the drawing,turns to the right by 90 degrees near an end portion of substrate 1, andenters phase shifter 10. A wire 22A extending downward from phaseshifter 10 enters first stage amplifier 11. A wire 23A extendingdownward from first stage amplifier 11 turns to the right neardistribution circuit 8, and enters second stage amplifier 12. A wire 24Aextending rightward from second stage amplifier 12 turns upward alongthe way, and enters third stage amplifier 13. A wire 25A extendingupward from third stage amplifier 13 enters isolator 14. A wire 26Aextending leftward from isolator 14 turns downward, and is connected tothrough conductor 15 provided substantially at the center ofamplification unit 3.

In the exemplary arrangement shown in FIG. 8, in each high-frequencyantenna module 100A, third stage amplifiers 13 in respectiveamplification units 3 have a distance therebetween which isapproximately half of the length of substrate 1. Further, third stageamplifiers 13 in adjacent high-frequency antenna modules 100A also havea distance therebetween which is approximately half of the length ofsubstrate 1. Here, it is assumed that third stage amplifiers 13 entirelyserve as heat generating portions. The heat generating portions arearranged at positions where a distance between the heat generatingportions is more than or equal to a determined distance such as 40% ofthe length of the substrate, for example, and a distance between eachheat generating portion and an end of the substrate is more than orequal to a determined distance such as 20% of the length of thesubstrate, for example.

Although not shown, an array antenna device 200A according to the secondembodiment has a metal base 50A and a base substrate 70A. When comparedwith metal base 50, metal base 50A has protruding portions 55A in theshape of a quadrangular prism arranged at positions immediately belowthe heat generating portions, in a number that is four times the numberof protruding portions 55 in metal base 50. Each protruding portions 55Ahas a cross section in the shape of a square, and the length of one sideof the square is approximately half of that in protruding portions 55.Base substrate 70A is provided with openings at positions correspondingto protruding portions 55A.

Array antenna device 200A operates in the same way as array antennadevice 200. A smaller-sized and thinner high-frequency antenna modulecan be achieved.

Heat is transferred from protruding portions 55A to metal base 50A.Since the number of protruding portions 55A is four times the number ofprotruding portions 55, the heat is transferred to metal base 50A in adispersed manner. Accordingly, protruding portions 55A can performcooling for base substrate 50A by natural air cooling or forced aircooling, more efficiently when compared with the first embodiment.

Third Embodiment

A third embodiment illustrates a case where a high-frequency antennamodule has two amplification units. FIG. 9 is a plan view illustratingarrangement of electronic components on a substrate of a high-frequencyantenna module according to the third embodiment of the presentdisclosure. In FIG. 9, components which are identical or equal to thosein FIGS. 1 to 7 are designated by the same reference numerals, and thedescription thereof is not repeated.

In a high-frequency antenna module 100B according to the thirdembodiment, an input port 6B and a distribution circuit 8B are providedat the center of a square substrate 1B. High-frequency antenna module100B has two amplification units 3B, and third stage amplifiers 13 arearranged above and below distribution circuit 8B in the drawing. Twoelement antennas 2 exist on a back surface of substrate 1B.

FIG. 10 is a plan view showing one example where the high-frequencyantenna modules according to the third embodiment are arranged in anarray. In FIG. 10, components which are identical or equal to those inFIGS. 1 to 7 are designated by the same reference numerals, and thedescription thereof is not repeated. FIG. 10 illustrates a case wherehigh-frequency antenna modules 100B are arranged such that third stageamplifiers 13 are not adjacent to one another. Adjacent high-frequencyantenna modules 100B are arranged in orientations different from oneanother by 90 degrees.

An array antenna device 200B including high-frequency antenna modules100B arranged as shown in FIG. 10 operates in the same way as arrayantenna device 200, and has the same effect as that of array antennadevice 200.

FIG. 11 is a plan view showing another example where the high-frequencyantenna modules according to the third embodiment are arranged in anarray. In FIG. 11, components which are identical or equal to those inFIGS. 1 to 7 are designated by the same reference numerals, and thedescription thereof is not repeated. FIG. 11 illustrates a case wherehigh-frequency antenna modules 100B are arranged such that third stageamplifiers 13 are adjacent to one another. All high-frequency antennamodules 100B are arranged in the same orientation. Since high-frequencyantenna modules 100B are arranged in the same orientation, the shape ofthe substrate is not limited to a square, and may be a rectangle, aparallelogram, or the like. The shape of the substrate may be anyquadrangle which is rotationally symmetric at a rotation of 180 degrees.

An array antenna device 200BA including high-frequency antenna modules100B arranged as shown in FIG. 11 operates in the same way as arrayantenna device 200A, and has the same effect as that of array antennadevice 200A.

Fourth Embodiment

A fourth embodiment illustrates a case where a high-frequency antennamodule has 16 amplification units. FIG. 12 is a plan view illustratingarrangement of electronic components on a substrate of a high-frequencyantenna module according to the fourth embodiment of the presentdisclosure. In FIG. 12, components which are identical or equal to thosein FIGS. 1 to 7 are designated by the same reference numerals, and thedescription thereof is not repeated.

On a substrate 1C of a high-frequency antenna module 100C according tothe fourth embodiment, there are one input port 6C, one primarydistribution circuit 8C, four wires 29 between distribution circuits,four secondary distribution circuits 9C, and 16 amplification units 3C.Primary distribution circuit 8C distributes an RF signal inputted toinput port 6C to four wires 29 between the distribution circuits. Eachwire 29 between the distribution circuits outputs the RF signal inputtedfrom primary distribution circuit 8C, to secondary distribution circuit9C. Each secondary distribution circuit 9C distributes the RF signalinputted through wire 29 between the distribution circuits, and outputsthe RF signal to four amplification units 3C. On a back surface ofsubstrate 1C, there are 16 element antennas 2 at positions correspondingto 16 amplification units 3C.

The arrangement of the electronic components within each amplificationunit 3C is the same as that in amplification unit 3, and may be the sameas that in amplification unit 3A. Further, the arrangement of onesecondary distribution circuit 9C and four amplification units 3C eachconfigured to amplify the RF signal distributed from secondarydistribution circuit 9C is the same as the arrangement of distributioncircuit 8 and amplification units 3.

In primary distribution circuit 8C, lengths of wires from an input pointof the RF signal to output points after distribution are identical. Inall secondary distribution circuits 9C, lengths of wires from an inputpoint of the RF signal to output points after distribution areidentical. All wires 29 between the distribution circuits have anidentical wire length. Lengths of wires are identical in allamplification units 3C. Therefore, lengths of the wires from input port6C to element antennas 2 to which respective amplification units 3C areconnected are all identical.

Although not shown, an array antenna device 200C according to the fourthembodiment has a plurality of high-frequency antenna modules 100Carranged in a two-dimensional array, a metal base 50C, and a basesubstrate 70C.

Array antenna device 200C operates in the same way as array antennadevice 200. A smaller-sized and thinner high-frequency antenna modulecan be achieved. Since 16 element antennas 2 correspond to one inputport 6C, the effect of sharing the input port is greater than that inthe case of high-frequency antenna module 100.

Fifth Embodiment

A fifth embodiment illustrates a case where the second embodiment ismodified such that a high-frequency antenna module does not have phaseshifters but has PLL (Phased Lock Loop) circuits. FIG. 13 is a circuitdiagram illustrating an electric configuration of a high-frequencyantenna module according to the fifth embodiment of the presentdisclosure. In FIG. 13, components which are identical or equal to thosein FIGS. 1 to 7 are designated by the same reference numerals, and thedescription thereof is not repeated.

A high-frequency antenna module 100D according to the fifth embodimenthas an input port 6D, a distribution circuit 8D, amplification units 3D,and element antennas 2. Instead of RF signal line 31, a reference signalline 34 for transmitting a reference signal (also referred to as areference clock signal) of several MHz to several tens of MHz isconnected to input port 6D. Distribution circuit 8D distributes thereference signal. The distributed reference signal is inputted to eachamplification unit 3D. Each amplification unit 3D has a PLL circuit 16,first stage amplifier 11, second stage amplifier 12, third stageamplifier 13, and isolator 14 connected in series. PLL circuit 16 has anoscillator therein, receives the control signal and the referencesignal, and outputs an RF signal of several GHz set to have an arbitraryphase. PLL circuit 16 is an RF signal generation circuit configured togenerate the RF signal based on the reference signal.

FIG. 14 is a plan view illustrating arrangement of electronic componentson substrates of the high-frequency antenna modules according to thefifth embodiment. In FIG. 14, components which are identical or equal tothose in FIGS. 1 to 7 are designated by the same reference numerals, andthe description thereof is not repeated. When compared with thearrangement in FIG. 8 in the case of the second embodiment, thearrangement in FIG. 14 is different in that PLL circuits 16 are arrangedat the positions of phase shifters 10. The positions at which thirdstage amplifiers 13 are arranged are identical to those in FIG. 8.Lengths of wires from input port 6D to element antennas 2 are identicalin respective amplification units 3D.

In an array antenna device 200D according to the fifth embodiment, thereference signal and the control signal are inputted, the RF signal isgenerated from the reference signal in each PLL circuit 16, and the RFsignal is emitted from each element antenna 2 to the space.

Since the high-frequency antenna module contains oscillators,low-frequency control signal and reference signal are inputted to thehigh-frequency antenna module. There is no need to use coaxialconnectors for the RF signal for the input ports and the connectors, andthus the input ports and the connectors can be manufacturedinexpensively.

The reference signal is transmitted from input port 6D to each PLLcircuit 16. The reference signal has a wavelength longer than that ofthe RF signal. Accordingly, a phase difference caused by an identicaldifference in wire length is smaller in the case of the referencesignal, than that in the case of the RF signal. Therefore, an allowableerror of wire lengths from input port 6D to PLL circuits 16, which isrequired to make the phase difference less than or equal to an allowablemaximum value, is longer in the case of the reference signal, than thatin the case of the RF signal.

Sixth Embodiment

A sixth embodiment illustrates a case where heat generating portions ofadjacent high-frequency antenna modules are arranged on regulartriangular substrates so as not to be adjacent to one another. FIG. 15is a plan view illustrating arrangement of electronic components onsubstrates of high-frequency antenna modules according to the sixthembodiment of the present disclosure. In FIG. 15, components which areidentical or equal to those in FIGS. 1 to 7 are designated by the samereference numerals, and the description thereof is not repeated.

On a regular triangular substrate 1E of each high-frequency antennamodule 100E according to the sixth embodiment, one input port 6E, onedistribution circuit 8E, and three amplification units 3E are arranged.Input port 6E and distribution circuit 8E are arranged near the centerof gravity of a triangle. In each amplification unit 3E, phase shifter10 and first stage amplifier 11 are arranged toward a vertex of thetriangle, and second stage amplifier 12, third stage amplifier 13, andisolator 14 are arranged along a side of the triangle. Through conductor15 is arranged on a side of isolator 14 away from the side of thetriangle.

An array antenna device 200E including high-frequency antenna modules100E arranged as shown in FIG. 15 operates in the same way as arrayantenna device 200A, and has the same effect as that of array antennadevice 200A.

Seventh Embodiment

A seventh embodiment illustrates a case where heat generating portionsof adjacent high-frequency antenna modules are arranged on regulartriangular substrates so as to be adjacent to one another. FIG. 16 is aplan view illustrating arrangement of electronic components onsubstrates of high-frequency antenna modules according to the seventhembodiment of the present disclosure. In FIG. 16, components which areidentical or equal to those in FIGS. 1 to 7 are designated by the samereference numerals, and the description thereof is not repeated.

On a regular triangular substrate 1F of each high-frequency antennamodule 100F according to the seventh embodiment, one input port 6F, onedistribution circuit 8F, and three amplification units 3F are arranged.Input port 6F and distribution circuit 8F are arranged near the centerof gravity of a triangle. In each amplification unit 3F, phase shifter10, first stage amplifier 11, second stage amplifier 12, and third stageamplifier 13 are arranged toward a vertex of the triangle. Isolator 14is arranged substantially at the center of a side of the triangle.Through conductor 15 is arranged on a side of isolator 14 away from theside of the triangle.

An array antenna device 200F including high-frequency antenna modules100F arranged as shown in FIG. 16 operates in the same way as arrayantenna device 200, and has the same effect as that of array antennadevice 200.

Eighth Embodiment

An eighth embodiment illustrates a case where heat generating portionsof adjacent high-frequency antenna modules are arranged on regularhexagonal substrates so as not to be adjacent to one another. FIG. 17 isa plan view illustrating arrangement of electronic components onsubstrates of high-frequency antenna modules according to the eighthembodiment of the present disclosure. In FIG. 17, components which areidentical or equal to those in FIGS. 1 to 7 are designated by the samereference numerals, and the description thereof is not repeated.

On a regular hexagonal substrate 1G of each high-frequency antennamodule 100G according to the eighth embodiment, one input port 6G, onedistribution circuit 8G, and six amplification units 3G are arranged.Input port 6G and distribution circuit 8G are arranged near the centerof gravity of a hexagon. In each amplification unit 3G, phase shifter 10and first stage amplifier 11 are arranged toward a vertex of thehexagon, and second stage amplifier 12, third stage amplifier 13, andisolator 14 are arranged along a side of the hexagon. Through conductor15 is arranged on a side of isolator 14 away from the side of thehexagon.

The number of amplification units may also be two or three. The sameapplies to the following embodiment.

An array antenna device 200G including high-frequency antenna modules100G arranged as shown in FIG. 17 operates in the same way as arrayantenna device 200A, and has the same effect as that of array antennadevice 200A.

Ninth Embodiment

A ninth embodiment illustrates a case where heat generating portions ofadjacent high-frequency antenna modules are arranged on regularhexagonal substrates so as to be adjacent to one another. FIG. 18 is aplan view illustrating arrangement of electronic components onsubstrates of high-frequency antenna modules according to the ninthembodiment of the present disclosure. In FIG. 18, components which areidentical or equal to those in FIGS. 1 to 7 are designated by the samereference numerals, and the description thereof is not repeated.

On a regular hexagonal substrate 1H of each high-frequency antennamodule 100H according to the ninth embodiment, one input port 6H, onedistribution circuit 8H, and six amplification units 3H are arranged.Input port 6H and distribution circuit 8H are arranged near the centerof gravity of a hexagon. In each amplification unit 3H, phase shifter10, first stage amplifier 11, second stage amplifier 12, and third stageamplifier 13 are arranged toward a vertex of the hexagon. Isolator 14 isarranged along a substantial center of a side of the hexagon. Throughconductor 15 is arranged on a side of isolator 14 away from the side ofthe hexagon.

An array antenna device 200H including high-frequency antenna modules100H arranged as shown in FIG. 18 operates in the same way as arrayantenna device 200A, and has the same effect as that of array antennadevice 200A.

In the present disclosure, the embodiments can be freely combined, orcan each be modified or omitted, within the scope of the spirit of thedisclosure.

REFERENCE SIGNS LIST

-   100: high-frequency antenna module (first embodiment),-   1: substrate,-   2: element antenna,-   3: amplification unit,-   4: metal block,-   5: screw,-   6: input port,-   7: through hole;-   8: distribution circuit,-   10: phase shifter,-   11: first stage amplifier,-   12: second stage amplifier,-   13: third stage amplifier (heat generating portion),-   14: isolator,-   15: through conductor (RF signal supplying portion),-   21: wire,-   22: wire,-   23: wire,-   24: wire,-   25: wire,-   26: wire,-   31: RF signal line,-   32: control signal line,-   33: DC power source line,-   200: array antenna device,-   50: metal base,-   55: protruding portion (cooling portion),-   60: connector,-   70: base substrate,-   75: wire,-   100A: high-frequency antenna module (second embodiment),-   1A: substrate,-   3A: amplification unit,-   8A: distribution circuit,-   21A: wire,-   22A: wire,-   23A: wire,-   24A: wire,-   25A: wire,-   26A: wire,-   200A: array antenna device,-   50A: metal base,-   55A: protruding portion (cooling portion),-   70A: base substrate,-   100B: high-frequency antenna module (third embodiment),-   1B: substrate,-   3B: amplification unit,-   6B: input port,-   8B: distribution circuit,-   200B: array antenna device,-   200BA: array antenna device,-   100C: high-frequency antenna module (fourth embodiment),-   1C: substrate,-   3C: amplification unit,-   6C: input port,-   8C: first distribution circuit,-   9C: second distribution circuit,-   29: wire between distribution circuits,-   200C: array antenna device,-   100D: high-frequency antenna module (fifth embodiment),-   3D: amplification unit,-   6D: input port,-   8D: distribution circuit,-   16: PLL circuit (RF signal generation circuit),-   34: reference signal line,-   200D: array antenna device,-   100E: high-frequency antenna module (sixth embodiment),-   1E: substrate,-   3E: amplification unit,-   6E: input port,-   8E: distribution circuit,-   200E: array antenna device,-   100F: high-frequency antenna module (seventh embodiment),-   1F: substrate,-   3F: amplification unit,-   6F: input port,-   8F: distribution circuit,-   200F: array antenna device,-   100G: high-frequency antenna module (eighth embodiment),-   1G: substrate,-   3G: amplification unit,-   6G: input port,-   8G: distribution circuit,-   200G: array antenna device,-   100H: high-frequency antenna module (ninth embodiment),-   1H: substrate,-   3H: amplification unit,-   6H: input port,-   8H: distribution circuit,-   200H: array antenna device.

The invention claimed is:
 1. A high-frequency antenna module comprising:a substrate; an input port to which an RF signal is inputted; adistribution circuit configured to distribute the RF signal inputted tothe input port; a plurality of amplification units which each have aplurality of cascade-connected amplifiers configured to amplify the RFsignal distributed by the distribution circuit, and which are arrangedon a first side of the substrate provided with the distribution circuitto be rotationally symmetric about the distribution circuit; a pluralityof antennas provided on a second side of the substrate opposite to thefirst side provided with the amplification units, and each of theplurality of antennas is configured to emit the RF signal amplified bythe amplification unit corresponding thereto to a space; and a pluralityof RF signal supplying portions, each of the plurality of RF signalsupplying portions being configured to supply the RF signal amplified bythe amplification unit to the antenna corresponding thereto.
 2. Thehigh-frequency antenna module according to claim 1, further comprising ametal casing configured to house the amplification units and thedistribution circuit between the substrate and the metal casing, anddissipate heat generated by a plurality of heat generating portions ofthe amplification units.
 3. The high-frequency antenna module accordingto claim 2, wherein the heat generating portions are arranged at cornerportions of the substrate.
 4. The high-frequency antenna moduleaccording to claim 2, wherein the heat generating portions are arrangedat positions where a distance between the heat generating portions ismore than or equal to a determined distance, and a distance between eachheat generating portion and an end of the substrate is more than orequal to another determined distance.
 5. An array antenna devicecomprising: a plurality of high-frequency antenna modules according toclaim 2 arranged in a two-dimensional array; a base substrate having aplurality of connectors connected to the input port; a module holdingportion configured to hold the plurality of high-frequency antennamodules and the base substrate; and a cooling portion configured to passthrough an opening provided in the base substrate, and come into contactwith the metal casing to cool the metal casing.
 6. The array antennadevice according to claim 5, wherein the cooling portion is brought intocontact with at least one of the metal casings at a positioncorresponding to at least one of the plurality of heat generatingportions of the array antenna device.
 7. The array antenna deviceaccording to claim 5, wherein the cooling portion is brought intocontact with the metal casings at positions corresponding to theplurality of heat generating portions of the array antenna device. 8.The high-frequency antenna module according to claim 1, wherein thehigh-frequency antenna module comprises four amplification units, andthe substrate has a main surface having a shape of a square.
 9. An arrayantenna device comprising: a plurality of high-frequency antenna modulesaccording to claim 1 arranged in a two-dimensional array; a basesubstrate having a plurality of connectors connected to the input port;and a module holding portion configured to hold the plurality ofhigh-frequency antenna modules and the base substrate.
 10. Ahigh-frequency antenna module comprising: a substrate; an input port towhich a reference signal is inputted; a distribution circuit configuredto distribute the reference signal inputted to the input port; aplurality of amplification units which each have an RF signal generationcircuit configured to generate an RF signal based on the referencesignal distributed by the distribution circuit, and a plurality ofcascade-connected amplifiers configured to amplify the RF signalgenerated by the RF signal generation circuit, and which are arranged ona first side of the substrate provided with the distribution circuit tobe rotationally symmetric about the distribution circuit; a plurality ofantennas provided on a second side of the substrate opposite to thefirst side provided with the amplification units, and each of theplurality of antennas is configured to emit the RF signal amplified bythe amplification unit corresponding thereto to a space; and a pluralityof RF signal supplying portions, each of the plurality of RF signalsupplying portions being configured to supply the RF signal amplified bythe amplification unit to the antenna corresponding thereto.
 11. Thehigh-frequency antenna module according to claim 10, further comprisinga metal casing configured to house the amplification units and thedistribution circuit between the substrate and the metal casing, anddissipate heat generated by heat generating portions of theamplification units.
 12. The high-frequency antenna module according toclaim 11, wherein the heat generating portions are arranged at cornerportions of the substrate.
 13. The high-frequency antenna moduleaccording to claim 11, wherein the heat generating portions are arrangedat positions where a distance between the heat generating portions ismore than or equal to a determined distance, and a distance between eachheat generating portion and an end of the substrate is more than orequal to another determined distance.
 14. An array antenna devicecomprising: a plurality of high-frequency antenna modules according toclaim 11 arranged in a two-dimensional array; a base substrate having aplurality of connectors connected to the input port; a module holdingportion configured to hold the plurality of high-frequency antennamodules and the base substrate; and a cooling portion configured to passthrough an opening provided in the base substrate, and come into contactwith the metal casing to cool the metal casing.
 15. The array antennadevice according to claim 14, wherein the cooling portion is broughtinto contact with at least one of the metal casings at a positioncorresponding to at least one of the plurality of heat generatingportions of the array antenna device.
 16. The array antenna deviceaccording to claim 14, wherein the cooling portion is brought intocontact with the metal casings at positions corresponding to theplurality of heat generating portions of the array antenna device. 17.The high-frequency antenna module according to claim 10, wherein thehigh-frequency antenna module comprises four amplification units, andthe substrate has a main surface having a shape of a square.
 18. Anarray antenna device comprising: a plurality of high-frequency antennamodules according to claim 10 arranged in a two-dimensional array; abase substrate having a plurality of connectors connected to the inputport; and a module holding portion configured to hold the plurality ofhigh-frequency antenna modules and the base substrate.